- Tata Electronics initiates exports of semiconductor chips packaged at its Bengaluru R&D centre, boosting India’s semiconductor ecosystem.
- Packaged chips are reportedly being shipped to partners in Japan, the US, and Europe, expanding Tata Electronics’ customer base.
- The company progresses towards final stages in designing integrated circuits and printed circuit boards for semiconductor chips, with commercial production slated for 2027.
Tata Electronics has commenced the export of semiconductor chip samples from its Bengaluru-based research and development centre, signaling a significant milestone for India’s semiconductor industry. According to reports, these packaged chips are being dispatched to Tata Electronics’ partners in Japan, the US, and Europe, marking an expansion of the company’s customer network.
Sources suggest that Tata Electronics is nearing the completion of the design process for integrated circuits and printed circuit boards of semiconductor chips in various nanometer sizes. These chips, ranging from 28 to 65 nanometers, will undergo testing and improvement based on feedback from select customers before commercial production, scheduled for 2027. Notably, the chips packaged by Tata Electronics have versatile applications, as they are not specifically tailored for a single purpose.
This development comes amidst Tata Group’s strategic initiatives to bolster India’s semiconductor capabilities, including the establishment of a new chip-packaging unit in Assam’s Morigaon and a $10 billion chip foundry in Gujarat’s Dholera. With Prime Minister Narendra Modi laying the foundation stone for the indigenous Semiconductor Assembly & Test Facility in Assam earlier this year, Tata Electronics, in collaboration with Taiwan’s Powerchip Semiconductor Manufacturing Corporation (PSMC), is also gearing up to launch India’s first AI-enabled fab in Dholera. This state-of-the-art facility aims to manufacture chips for various applications, including power management IC, display drivers, microcontrollers (MCU), and high-performance computing logic, with the first chip expected to roll out before the end of 2026.
