Key Points
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Smartphone PLI 2.0: India Chipset Design plan includes creating 30 strategic chips for domestic and export needs.
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Smartphone PLI 2.0: India Chipset Design aims to raise local value addition in electronics to 35–40%.
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Smartphone PLI 2.0: India Chipset Design progress strengthens India’s semiconductor and smartphone manufacturing roadmap.
Smartphone PLI 2.0: India Chipset Design Strategy Moves Forward with Government–Industry Cooperation
Smartphone PLI 2.0: India Chipset Design is becoming one of the core focus areas of the Indian government as it works closely with the smartphone industry to shape the next phase of its production-linked incentive scheme. Union IT and Electronics Minister Ashwini Vaishnaw confirmed that the government is already in discussions with industry stakeholders as the first PLI scheme for smartphones is set to conclude this fiscal year. The first phase has been one of India’s most successful programmes, attracting major global manufacturers like Apple and Samsung and helping India emerge as a major global smartphone production hub. With exports rising rapidly, the government aims to sustain and build on this momentum through PLI 2.0. The minister highlighted that 24 approved electronics component projects, along with future investments under ECMS 2.0, will significantly boost domestic manufacturing capabilities in the next few years.
Smartphone PLI 2.0: India Chipset Design efforts aim to push local value addition in smartphones and major electronics to nearly 35–40%. According to Vaishnaw, once electronic components begin getting fully manufactured in India, local value addition will naturally increase. Components like printed circuit boards (PCBs), camera modules, and passive components are already moving toward large-scale local production. Over time, India expects to meet 100% of its requirements for several components and even position itself as a global supplier for specific categories. Companies in the smartphone and electronics supply chain have been requesting the government to extend and upgrade the PLI scheme to maintain India’s competitiveness against major manufacturing nations such as China and Vietnam. With global brands expanding production and exports, industry leaders believe that continued policy support is essential for India to reach its target of $500 billion in electronics output by 2030.
Smartphone PLI 2.0: India Chipset Design Vision Includes 30 Strategic Chips
Smartphone PLI 2.0: India Chipset Design plans reflect India’s ambitious semiconductor roadmap. Ashwini Vaishnaw reiterated that the government is working actively on designing and manufacturing 30 strategic chipsets within the country. These chips will support both domestic needs and global exports, forming a strong backbone for India’s semiconductor ecosystem. The government has categorized these chips into three important groups: high-value low-volume chips, medium-value medium-volume chips, and low-value high-volume chips. A team led by the Principal Scientific Advisor, Professor Sood, has already prepared the first list of priority chipsets. The government is now collaborating with industry experts and additional stakeholders to refine this list further before moving it toward implementation. This initiative marks one of India’s biggest steps toward achieving long-term technological independence.
Smartphone PLI 2.0: India Chipset Design roadmap also recognizes the strategic importance of semiconductors in global supply chains. With geopolitical tensions reshaping the electronics and chip manufacturing landscape, countries worldwide are attempting to reduce dependence on foreign semiconductor markets. India’s push for domestic chipset design and manufacturing aligns with this global trend. By focusing on strategic, high-need chip categories, India aims to create a stable, resilient semiconductor base that can support critical sectors including smartphones, automobiles, telecom, defence systems, and advanced computing. In addition to meeting Indian industry requirements, these chipsets are expected to create export opportunities, enabling India to become a more competitive player in the international semiconductor market. The government’s long-term vision is to reduce imports, strengthen local innovation, and build manufacturing ecosystems around these chipsets.
Smartphone PLI 2.0: India Chipset Design to Strengthen India’s Electronics Export Growth
Smartphone PLI 2.0: India Chipset Design is emerging at a time when India’s electronics exports have been rising faster than ever. According to the India Cellular and Electronics Association (ICEA), electronics exports increased from $29.1 billion in FY24 to $38.6 billion in FY25. A major portion of this rise is driven by record-breaking smartphone exports from companies such as Apple and Samsung. India has quickly transformed from an import-heavy nation to a competitive smartphone exporter within a few years. The first PLI scheme played a major role in achieving this transformation by encouraging global companies to shift part of their manufacturing base to India. With PLI 2.0 on the horizon, industry players hope the government will expand the scheme, extend support, and ensure stronger incentives for high-value component manufacturing.
Smartphone PLI 2.0: India Chipset Design expectations remain high among industry leaders. Many businesses argue that without continued incentives, India risks losing competitiveness to manufacturing powerhouses such as China and Vietnam, which already have established supply chains and strong export advantages. Industry executives believe that stable policy support is essential if India wants to achieve ambitious targets, including becoming a major global electronics exporter and building a successful semiconductor industry. While the government agrees with the need for continuity, formal consultations on the PLI 2.0 scheme have not yet begun. However, Vaishnaw’s recent comments indicate that planning is actively underway and official discussions are expected soon.
Smartphone PLI 2.0: India Chipset Design Boosts Domestic Capability and Reduces Import Dependence
Smartphone PLI 2.0: India Chipset Design initiatives reflect India’s broader mission to reduce dependence on imported electronics components. As Vaishnaw explained, India is moving quickly toward manufacturing most essential components domestically. With PCBs, camera modules, and passive components entering large-scale production, India is on track to meet a major share of its own component needs in the coming years. This shift will not only support domestic smartphone production but also strengthen India’s position as a reliable global supplier. The long-term goal is to create a complete, end-to-end electronics ecosystem, covering everything from basic components to advanced chipsets, all manufactured in India.
Smartphone PLI 2.0: India Chipset Design progress marks a turning point for India’s technological and manufacturing ambitions. If implemented successfully, the design and production of 30 key chipsets can place India among the emerging global semiconductor hubs. Combined with rising smartphone exports, growing component manufacturing capacity, and strong government support, India is positioning itself for a major transformation. The next phase of the PLI scheme will be crucial in determining how fast and how effectively the country can reach these targets. With industry collaboration, policy continuity, and innovation-driven investments, India aims to build a future where it is not only a manufacturing destination but also a global leader in electronics and semiconductor technology.
